About Us
Embedded Engineering Global Partner
Embedded Engineering Global Partner
Our embedded product engineering business unit is a journey that converges over two decades of engineering expertise, latest facilities, lab setup, and capable partners. Together, they help us envision and achieve the unique – new possibilities across system design, SoM applications, embedded engineering services, and more.
Differentiating the design and engineering of turnkey
embedded products on in-house infrastructure, experts, best
practices, and cost-effective approaches, we bring products
to reality – faster and smarter.
Diverse expertise and depth of Tessolve’s industry knowledge
means MNC giants and fast innovators bank on our
engineering and capability to scale and deliver globally.
Co-Founder & CEO
Srini has over 25 years of experience in Semiconductor Engineering and Management. He held technical and management positions at Cirrus Logic and Centillium Communications prior to joining Tessolve as Co-Founder. He has extensive experience in Silicon Validation, Product Engineering and has managed high volume productization of several complex Systems on Chip and Mixed Signal devices. He takes pleasure in building startup teams into world class organizations. Srini completed his Master in Electrical Engineering from the University of Southern California and Bachelor in Electronics from Birla Institute of Technology.
We treat our employees with respect and fairness while earning their trust and fostering excellence.
We focus on creating value for our customers and enabling them to bring quality products to market faster and cost-effectively.
We take pride in our work and contribute towards engineering excellence in everything we do. We are always self-driven and proactive.
We think out-of-the-box and innovate. We take challenges as opportunities and use them to enhance our experience and expertise.