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Software Configurable Binning

Optimize device classification & yield improvement with flexible, software-driven binning strategies that adapt to diverse testing requirements.

Maximizes Test Socket Lifetime

Extend test socket lifespan, reducing replacement costs and ensuring consistent performance over multiple cycles.

Prevents IC Double Stacking & Device Misplacement

Prevent costly errors from double stacking and misalignment, enhancing system integrity during testing.

Continuous Automated Re-test Capabilities

Enables automated retesting of devices over time to monitor performance and identify defects.

Operational Mode From Ambient to 125℃

Supports testing across a wide temperature range, simulating real-world conditions.

Envisioning Enhanced System Level Testing? Let’s Make it Happen.

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