RENESAS &
Powered by the DRP-AI3 accelerator, delivering
efficient AI computations.
efficient AI computations.
Equipped with PCIe, USB, GbE, and MIPI interfaces for seamless
integration across diverse systems.
integration across diverse systems.
Built for extreme environments with an operational range
of -40°C to +125°C, ensuring reliability.
of -40°C to +125°C, ensuring reliability.
Overview
Leveraging Renesas RZ/V2H for advanced embedded solutions
Tessolve, in collaboration with Renesas, offers advanced solutions powered by the RZ/V2H platform, designed to support AI-driven applications across various industries. These SoMs provide powerful processing, seamless integration, and reliable performance, making them ideal for sectors like industrial automation and transportation. With Tessolve’s expertise in embedded systems and Renesas’s cutting-edge technology, we’re enabling innovation in AI, computer vision, and real-time processing.
Key Highlights
Top features of Renesas integrated with
Tessolve’s engineering
Broad Market Applicability
Tailored solutions for various industries, including industrial automation, transportation, and real-time AI-driven applications.
Optimized Power
Efficiency
Combines advanced performance with low power consumption, ideal for energy-sensitive applications..
Enhanced
Connectivity
Features multiple interfaces, including PCIe, USB, GbE, and MIPI, ensuring seamless integration with diverse systems and scalability for future needs.
Industrial-Grade Performance
Designed for operation in extreme conditions (-40°C to +125°C), ensuring reliability in harsh environments and mission-critical applications.
AI-Driven
Processing
Leveraging the Renesas RZ/V2H platform with DRP-AI3 acceleration, enabling efficient AI computations.
End-to-end
Expertise
Supported by Tessolve’s comprehensive product engineering services, from design and development to production and lifecycle management.
Renesas SOM Modules
In-depth look at Renesas’s range
of system on modules
Provides a comprehensive development platform for RZ/V2H SMARC modules, offering extensive connectivity and expansion options. The board enables rapid prototyping and development with multiple camera interfaces, networking capabilities, and versatile storage options, making it ideal for industrial and vision-based applications.
Multiple connectivity interfaces including USB 3.0, CAN, and various expansion headers
for flexibility.
for flexibility.
Advanced SMARC 2.1 compliant interface supporting TESSOLVE RZ/V2H modules for seamless integration.
Versatile expansion options with M.2 slots supporting storage, cellular, and WiFi/Bluetooth capabilities.
Power delivery through USB Type-C connector with modern USB-PD support for reliable operation.
Access more details about Carrier board for TESSOLVE RZ/V2H SMARC Module
Datasheet PDF Download
Revolutionizes industrial automation with its powerful AI-driven vision processing capabilities, enabling faster and more accurate machine vision. The module’s unique combination of real-time processing, integrated AI acceleration, & extensive interfaces empowers manufacturers to develop next-generation autonomous systems reducing development time and complexity.
Advanced processor architecture with quad Cortex-A55, dual Cortex-R8, and Cortex-M33 for comprehensive computing.
Extensive connectivity with dual PCIe Gen3, USB 3.2 ports, and dual Gigabit Ethernet
interfaces.
interfaces.
Integrated AI accelerator and DRP for efficient machine learning and image processing acceleration.
Industrial-grade temperature range from -40°C to +125°C for reliable operation in harsh environments.
Access more details about Renesas RZ/V2H based SMARC SoM
Datasheet PDF Download
The RZ/V2N is a high-performance vision AI MPU powered by Renesas’ DRP-AI3 accelerator, delivering up to 15 TOPS of AI performance. It features quad Arm® Cortex®-A55 CPUs with an Arm® Cortex®- M33, integrated ISP, and dual-channel MIPI® CSI-2® interfaces for efficient dual-camera processing. It is ideal for applications such as driver monitoring systems, surveillance cameras, and mobile robotics.
Standardized 82mm x 50mm interface supporting seamless integration with SMARC carrier boards for flexible system design.
MIPI CSI interfaces with 2-lane and 4-lane configurations enabling multi-camera vision systems with optional Arm Mali-C55 ISP.
PCIe Gen3 x2, USB 3.2 Gen2, dual Gigabit Ethernet with IEEE1588 AVB support, and CAN-FD interfaces.
Operating ranges from -40°C to +85°C ensures reliable performance in harsh industrial environments.
Access more details about RZ/V2N SMARC module
Datasheet PDF Download
Comparison
Find the right module for your
embedded applications!
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–
2x Gigabit Ethernet (GbE) ports with RJ45 connectors
2x USB 3.0 available via a stacked connector
Suitable for commercial environments
- Quad-core Arm® Cortex®-A55
- Dual Arm® Cortex®-R8
–
2x Gigabit Ethernet (GbE) ports for high-speed networking
2x USB 3.2 and 1x USB 2.0 ports
-40°C to +85°C
- Dual Arm® Cortex® – A55 cores @1.8GHz
- 32-bit Arm® Cortex®-M33 processor System management (up to 200 MHz)
- 8GB LPDDR4
- 32GB eMMC
- 64MB QSPI
- 1KB EEPROM
2x 10/100/1000 ports
- 1x USB 2.0
- 1x USB 3.2
-40 Deg C to +85 Deg C
The Power Of Renesas & Tessolve
A powerful collaboration for next-gen
embedded engineering
With Tessolve and Renesas working together, we provide state-of-the-art solutions powered by the advanced RZ/V2H platform, engineered to meet the needs of AI-driven applications across industries, providing advanced processing capabilities, seamless integration, and exceptional performance.
What sets Tessolve apart is our deep expertise in embedded systems, coupled with Renesas’s innovative RZ/V2H platform, which accelerates the development of AI, computer vision, and real-time processing applications. This collaboration guarantees to:
- Provide high-performance, scalable solutions tailored to your needs.
- Accelerate product development cycles, enabling faster time-to-market.
- Ensure seamless product deployment from initial concept through to final launch.
