Hi-Tech Solutions
Engineering The Future – From Silicon to Intelligent Systems
Overview
Trusted engineering
partner for next-gen
technologies
Tessolve empowers global semiconductor, consumer electronics,
telecom, hyperscaler, and digital infrastructure companies with deep
chip-to-cloud engineering expertise that accelerates innovation and
delivers product excellence.
telecom, hyperscaler, and digital infrastructure companies with deep
chip-to-cloud engineering expertise that accelerates innovation and
delivers product excellence.
Hi-Tech Industries We Support
Enabling complex & high-growth technology
ecosystems in various sectors
- Semiconductors
- Telecom & Wireless
- Consumer Electronics
- Semicon Automotive
- Hyperscalers
- Digital Infrastructure, Data Centre & Edge Computing
Pre- & Post-Silicon Validation
ArcShift – Arm-to–RISC-V Migration
Hardware, Firmware & Embedded Development
System Level Test (SLT)
AI-Enhanced Debug & Execution
Platform
Integration
Integration
Carrier Acceptance Testing
End-to-End Automation
Foundry Porting
RF, Protocol & Modem Testing
Ethernet Switch & Network Device Engineering
FPGA Development
Wireless Testing: 4G/5G/6G, Wi-Fi, Bluetooth, IoT
Pre-Conformance (GCF/PTCRB)
Application Testing
Carrier Acceptance Testing
Firmware, Software & Hardware Development
Hardware, Industrial & Mechanical Design
CPE Product Design & Development
FPGA
Development
Wireless Testing & Certification
Product Engineering & Value Engineering
Embedded, DSP & Firmware Engineering
Regulatory & Compliance Testing
Platform &
Software
Development
OS Porting
Board Support Package & Device Drivers
Cybersecurity
MCAL/BSW,
AUTOSAR &
Functional Safety
ASPICE-Compliant UFS/LPDDR Protocol Development & Validation
SoC Firmware, BSP & Hypervisor Development
SoM Design & Development
Software Platform Engineering & Validation
Physical
Design
Product Re-design & Value Engineering
Sustenance Engineering
Intelligent Automation & Test Services
FPGA Programming
SoM & FPGA Development
Embedded Firmware & Driver Development
AI Data Center Platform Validation
Edge Computing Platform Testing
Pre-Silicon & System-Level Validation
SoC Testing
Our Approach
How we deliver engineering
excellence at scale
Understand & Define
We align with your product goals, technology roadmap, and performance expectations to define a clear engineering path.
Co-Innovate & Develop
Cross-functional teams collaborate to architect and build scalable, future-ready solutions using best-in-class engineering practices.
Validate & Optimize
Comprehensive validation, automation, and optimization ensure reliability, performance, and compliance at every milestone.
Scale & Sustain
From production scaling to product sustenance and next-gen enhancements — we support your long-term roadmap.
Value Delivered
Outcomes that matter to
your business
Accelerated Product Innovation
Faster development cycles enabled by deep domain expertise and strong validation frameworks.
Reliable, Scalable Engineering
Proven systems to support complex silicon, platform, and cloud-scale
deployments.
End-to-End Chip-to-Cloud Expertise
One engineering partner for silicon, software, connectivity, and digital
platforms.
Strategic Talent & Global Lab Advantage
Access to large engineering teams and world-class labs across multiple
High-Quality, Cost-Optimized Delivery
Flexible models enabling engineering scale without expanding internal overhead.
Chip-to-Cloud (C2C) Capabilities
Connecting silicon intelligence
to cloud scale
Platform & Product Engineering
- Concept & Benchmarking
- Embedded Development
- Automotive SoC Platform Development
- Open-Source OS Porting
Software,
Cloud & DevOps
- DevOps Testing & Cloud VOD Services
- GUI & Tool Development
- Android Framework & Application
Development
Cloud
Security
- Chip-to-Cloud Security
Enablement - Cybersecurity
Engineering
Connectivity & Wireless
- 5G, Wi-Fi, IoT Testing
- Automation for Wireless Protocols
- CPE & Multimedia Testing
Software, Cloud & DevOps
- DevOps Testing & Cloud VOD Services
- GUI & Tool Development
- Android Framework & Application
Development
Software & System Engineering Capabilities
Powering Modern Products with Integrated Engineering
System Architecture & Design
Middleware Development
System-Level Testing
SoM Platform Solutions
Firmware & BSP Engineering
Application Development
Post-Silicon Validation
Certifications
Engineering Expertise
550+ Engineering Specialists
Hardware, Connectivity & Systems Engineering
- A strong mix of Embedded Software (43%), Validation & SLT (35%), Hardware, Connectivity, and System Engineering talent working across global programs.
Why Global Leaders Trust Tessolve
A legacy of excellence defined by impact
20+ years
of proven
engineering
excellence
Chip-to-Cloud (C2C) and Concept-to-Manufacturing (C2M) capabilities
State-of-the-art labs in India, Germany, USA, Malaysia & Singapore
3,500+ engineers supporting 8 of the top 10 semiconductor companies
Deep co-innovation partnerships with global silicon, platform
