QUALCOMM &
Supports extensive interfaces and modular scalability to
accelerate development across diverse industries.
accelerate development across diverse industries.
Leverages advanced Qualcomm Snapdragon processors for
superior CPU, GPU, and AI computing capabilities.
superior CPU, GPU, and AI computing capabilities.
Ensures high performance, low power consumption,
and seamless connectivity for next-generation applications.
and seamless connectivity for next-generation applications.
Overview
Enabling smarter embedded systems with Qualcomm SOMs
Tessolve’s Qualcomm SOM solutions, supported by the Qualcomm Advantage Network (QAN), are designed to transform embedded solution engineering. These SOMs combine Qualcomm’s advanced technologies with a collaborative ecosystem of solution providers to deliver high-performance, scalable, and reliable designs. As part of QAN, Tessolve offers comprehensive services, including design, regulatory compliance, manufacturing, and lifecycle support, ensuring a smooth journey from development to production. With our expertise, customers can bring their products to market faster and innovate with ease.
Key Highlights
Driving innovation in embedded engineering
with the power of Qualcomm SoM
Advanced Connectivity
Integrated 5G, Wi-Fi 6, and Bluetooth 5.2 technologies, ensuring high-speed, low-latency communication for seamless device interactions.
Scalable and
Modular Design
Offers flexible architecture with extensive I/O support, allowing easy integration and scalability for various industry applications.
Energy-Efficient
Operation
Optimized power management and dynamic scaling to enhance battery life and reduce thermal footprints, crucial for compact devices.
High-Performance Processing
Powered by Qualcomm’s Snapdragon processors, delivering exceptional CPU, GPU, and AI capabilities for demanding embedded applications.
Enhanced
Security
Built-in hardware-based security protocols, including secure boot and data encryption, to safeguard sensitive information and devices.
Global
Support
Backed by Qualcomm’s global presence and extensive partner ecosystem, enabling rapid deployment and long-term support for embedded solutions.
Qualcomm SOM Modules
In-depth look at Qualcomm’s range of
system on modules
- SDA845 NANO SoM
- Carrier Board for SDA845 NANO SoM
- QCS6490 LGA SoM
- Carrier Board for QCS6490 LGA SoM
- SD820 SMARC 2.0 SoM
- Carrier Board for QTI SD820 SMARC 2.0 SoM
Compact yet powerful computing module (50 x 28 mm) that enables advanced AI and machine learning capabilities for your embedded applications. With its heterogeneous computing architecture and dedicated AI Engine, it delivers exceptional performance while maintaining efficient power management, making it ideal for demanding edge computing solutions requiring up to 4K video processing.
Rich multimedia support with 4K@60 encode/decode and dual 4-lane MIPI interfaces for display/camera.
Comprehensive connectivity including WiFi 802.11ac, Bluetooth 5.2, dual PCIe, and
USB 3.1 ports.
USB 3.1 ports.
Industrial-grade temperature range (-20°C to +85°C) with hardware-based power management.
Robust memory configuration with 6GB LPDDR4x RAM and 64GB UFS storage for seamless multitasking.
Access more details about SDA845 NANO SoM
Datasheet PDF Download
The Carrier Board for SDA845 NANO SoM is a versatile Mini-ITX (170 x 170 mm) development platform accelerating your product development in multimedia, HMI, and surveillance applications. Designed for industrial and automotive environments, it provides extensive connectivity options and comes with complete software support including Android 9.0 and Linux BSP, enabling rapid prototyping and deployment of professional embedded solutions.
Advanced multimedia
capabilities with triple
MIPI-CSI camera
inputs.
capabilities with triple
MIPI-CSI camera
inputs.
Extensive connectivity through Gigabit Ethernet, multiple USB ports (Type-A/C), PCIe, and expansion headers.
Display support with dual MIPI-DSI, HDMI output, and FPD serializer interfaces for flexible display configurations.
Industrial-grade power solution with 12V DC input and multiple buck regulators
for stable operation.
for stable operation.
Access more details about Carrier Board for SDA845 NANO SoM
Datasheet PDF Download
Purpose-built for industrial and commercial applications, this module delivers exceptional performance and reliability for demanding use cases from ruggedized tablets to point-of-sale systems, while supporting both Linux Ubuntu and other operating systems with an industrial temperature range.
Advanced heterogeneous computing with octa-core processor (4x Cortex-A78 + 4x Cortex-A55) and dedicated AI Engine.
Premium multimedia processing with Adreno 643L GPU and five 4-lane MIPI CSI interfaces for extensive camera support.
Next-generation connectivity with Wi-Fi 6E and Bluetooth 5.4 for high-speed, reliable wireless communications.
Industrial-grade design with -20°C to +85°C temperature range and 505-pad LGA form factor for reliable deployment.
Access more details about QCS6490 LGA SoM
Datasheet PDF Download
Designed with extensive connectivity options and flexible power delivery through USB Type-C with Power Delivery (PD), this board enables rapid prototyping and testing of industrial IoT solutions while providing robust expansion capabilities through M.2 connectors for cellular, WiFi, and storage extensions.
Versatile display and camera interfaces with MIPI DSI output and support for up to 4x GMSL2 cameras through camera adapter board.
Advanced power management with USB Type-C Power Delivery and 12V@5A power jack
for flexible power
options.
for flexible power
options.
Comprehensive I/O through expansion header including I2C, SPI, I2S, GPIO, and USB 2.0 for peripheral integration.
Full software development support with Ubuntu Linux and SMARC 2.1 compatibility for rapid application development.
Access more details about Carrier Board for QCS6490 LGA SoM
Datasheet PDF Download
Ultra-low power SMARC 2.0 module powered by Snapdragon SD820, delivering high-performance computing with quad-core 64-bit processing for demanding industrial and multimedia applications. Perfect for HMI units, surveillance systems, and infotainment solutions that require robust processing in a compact form factor.
High-performance quad-core Kryo processor with 2.15 GHz Gold and 1.6 GHz Silver clusters for optimal processing efficiency.
Comprehensive connectivity suite with PCIe 2.1, USB 3.0, WiFi 802.11ac, Bluetooth 4.2, ensuring high-speed data transmission.
Versatile display support with dual MIPI DSI and HDMI 2.0 interfaces for multiple display configurations.
Industrial-grade temperature range of -20°C to +85°C with complete Android BSP support.
Access more details about SD820 SMARC 2.0 SoM
Datasheet PDF Download
Comprehensive evaluation and development platform designed to unlock the full potential of Tessolve’s SD820 SMARC 2.0 SoM, offering extensive connectivity options and robust peripheral support. Ideal for rapid prototyping and development of industrial HMI, multimedia, and surveillance applications with its rich set of interfaces and sensor integration capabilities.
Compact 120mm x 90mm form factor ideal for space-constrained industrial and embedded applications.
Complete sensor suite including magnetic, accelerometer, and gyroscope for motion-sensitive applications.
Extensive connectivity with USB 3.0, PCIe 2.0, and multiple UART/I2C/SPI interfaces for peripheral expansion.
Debug capabilities with a dedicated USB 2.0 Micro B connector for development efficiency.
Access more details about Carrier Board for QTI SD820 SMARC 2.0 SoM
Datasheet PDF Download
Comparison
Optimize Your Embedded Applications
with the Ideal Module!
Powered by 8x Qualcomm® Kryo™ 385 cores
LPDDR4x-1866, Upto 8GB (x64 bits)
–
2x USB 3.1
-20°C to +85°C
Quad high-performance Kryo cores at
2.649 GHz
LPDDR4x-1866, Upto 8GB (x64 bits)
–
2 x USB 3.1
-20°C to +85°C
- 4x Arm® Cortex®-A55 cores for power efficiency.
- 4x Arm® Cortex®-A78 cores for high performance.
LPDDR4x-8GB
–
- 1x USB 3.1
- 1x USB 2.0
-20°C to +85°C
The Power of Qualcomm & Tessolve
Qualcomm’s technology, Tessolve’s expertise:
A winning combination
As part of the Qualcomm Advantage Network (QAN), Tessolve combines Qualcomm’s advanced technologies with its engineering expertise to deliver innovative embedded solutions. This partnership enables:
- Collaborative Ecosystem: Leveraging Qualcomm technologies for scalable, market-ready solutions.
- Comprehensive Support: Services include design, development, regulatory qualifications, manufacturing, and lifecycle management.
- Faster Time-to-Market: Ensuring seamless transitions from development to production.
This collaboration ensures advanced, reliable products meeting the evolving demands of the embedded industry.
Accelerate Product Development with End-to-End Embedded Solutions from Tessolve and Qualcomm
Contact Now
