Semiconductor Industry
Engineering Semiconductors, Engineering A Smarter World
Overview
Navigating the semiconductor frontier with system engineering
Tessolve offers end-to-end chip design and embedded engineering solutions, from RTL to GDSII. Our experienced team ensures seamless integration, verification, physical design, DFT, and hardware design, delivering high-quality SoC solutions. We collaborate with semiconductor companies like NXP, Qualcomm, and MediaTek to accelerate time-to-market for innovative products. Our comprehensive services include FPGA implementation, test automation, reference design creation, BSP development, device drivers, and demo apps, providing a complete solution for global clients.
Strength
Expert engineering services to enhance
semiconductor market strategies
Comprehensive Wireless
Testing Services
Unique wireless testing services are delivered specifically for silicon customers.
End-to-End Evaluation
Board Solutions
Design, validation, manufacturing, and volume supply of evaluation boards are offered.
Innovative Engineering and
Development Services
Engineering services are offered to semiconductor firms, developing SoC solutions for OEMs’ market strategies.
Competence
Industry-specific design & development
as per latest standards
Post Silicon Validation
- PSV HW design
- Firmware/bare metal coding
- Board level simulation– Logic & arch validation
- Power & performance validation
Reference Platform Development
- Chipset aligned platform definition
- IO definition & system architecture, component selection
- HW design & simulations
- Firmware, driver, BSP development & porting (Linux/RTOS/Android)
SDK, GUI Development
- Middleware integration
- Tools, libraries, example code, package creation
- QT/android UI development
- PC GUI development
Demo Application
- Marketing demo development (chipset use case)
- Mechanical enclosure rapid prototyping
- Eval kit manufacturing, packaging & supply
Our Advantage
Accelerating semiconductor design to be
faster, smarter, and more efficient
End-to-end services covering the complete chip design lifecycle
High-speed SoC & block-level implementation for superior performance
Comprehensive solutions for all your chip design needs
Experienced engineers with decades of successful tape-out projects
Expertise across multiple technology nodes, including 5nm to 40nm
